| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a build-up multilayer wiring board which has a solder resist disposed on its surface, where a Cu layer and the solder resist are disposed on an insulating layer with the Cu layer which is a base board for forming a pad part to be electrically connected with a terminal part of a semiconductor element, by soldering separated from the solder resist in an opening of a pad part of the solder resist, and which is provided with the pad part of a soldering joint strength higher than that of an NMSD pad to be connected with solder having equal diameter. <P>SOLUTION: In the multilayer wiring board, the Cu layer and the solder resist are disposed on the insulating layer, with the Cu layer which is a base board for forming the pad part to be electrically connected with the terminal part of the semiconductor element, by soldering separated from the solder resist in the opening for forming the pad part of the solder resist. A barrier-property deposit functioning as a barrier between the Cu layer and the solder is disposed on the Cu layer and on the insulating layer in the opening of the pad part of the solder resist. <P>COPYRIGHT: (C)2004,JPO</p> |
