| 摘要 |
<P>PROBLEM TO BE SOLVED: To reduce the chip size by reducing the number of bonding pads. <P>SOLUTION: In a semiconductor device in which the bonding pads exposing the electrode portions of wiring are provided in the openings formed on an insulating film, a plurality of openings is provided in a single electrode portion, and bonding wires are respectively connected to the openings. The bonding wires connected to the openings are connected to the same lead or respectively connected to a plurality of adjacently arranged leads. When the semiconductor device is constituted in this way, the capacity of power source cells can be increased with an equivalent occupying area by also utilizing the area between the cells as a power supply cell, because the cells are arranged in expanded states in an area in which two normal power supply cells are arranged. Therefore, the chip size of the semiconductor chip can be reduced by reducing the number of bonding pads required for the whole semiconductor chip, and decreasing the outer peripheral length of the chip required for arranging the bonding pads. <P>COPYRIGHT: (C)2004,JPO |
