发明名称 SEMICONDUCTOR DEVICE AND ITS MANUFACTURING METHOD
摘要 PROBLEM TO BE SOLVED: To provide a semiconductor device having a laminated gate structure, wherein a threshold hardly varies even if microfabrication is proceeded. SOLUTION: The device has a first gate electrode 5 formed on a first gate insulation film 4, a second gate insulation film 6 formed on the first gate electrode 5, and a second gate electrode 7 formed on the second gate insulation film 6. The first gate electrode 5 has a first part 5-1 with a first width W1 and a second part 5-2 with a width W2 which is narrower than the first width W1. A distance L from a side surface of the second part 5-2 to a side surface of an element isolation region 2 is longer than the distance from a side surface of the first part 5-1 to a side surface of the element isolation region 2. COPYRIGHT: (C)2004,JPO
申请公布号 JP2004022819(A) 申请公布日期 2004.01.22
申请号 JP20020175917 申请日期 2002.06.17
申请人 TOSHIBA CORP 发明人 KAI NAOKI
分类号 H01L21/8247;H01L27/115;H01L29/788;H01L29/792;(IPC1-7):H01L21/824 主分类号 H01L21/8247
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