| 摘要 |
PROBLEM TO BE SOLVED: To provide a semiconductor-sealing resin composition which has not only high flame retardancy but also excellent moisture resistance, metal migration resistance and flowability. SOLUTION: This semiconductor-sealing resin composition is characterized by comprising the following components (A) to (E). (A) is an epoxy resin. (B) is a phenolic resin. (C) is an inorganic filler. (D) is a metal hydroxide represented by general formula (1). (E) is a phosphazene compound produced by cross-linking at least one of a cyclic phenoxyphosphazene represented by general formula (2) and a straight chain phenoxyphosphazene represented by general formula (3) with at least one cross-linking group selected from the group consisting of o-phenylene, m-phenylene, p-phenylene and a bisphenylene represented by general formula (4), wherein the cross-linking group is placed between the phenyl group-released two oxygen atoms of the phenoxyphosphazene. COPYRIGHT: (C)2004,JPO
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