发明名称 RESIN COMPOSITION COMPRISING INORGANIC COMPOUND AND LAMINATE AND PACKAGE USING THE SAME
摘要 PROBLEM TO BE SOLVED: To provide a resin composition comprising a hygroscopic inorganic compound having excellent moisture barrier properties, flexibility, elastic recovery and falling impact resistance and to provide a laminate and a package using the resin composition. SOLUTION: The resin composition comprises 100 pts. wt. of a polymer consisting essentially of a polyolefin resin and 1-100 pts. wt. of at least the inorganic compound. In the resin composition, a polyolefinic resin (resinα) such as an ethylene-α-olefin copolymer or an ethylene-cyclic olefin copolymer obtained by using a single-site catalyst composed of a complex composed of groups III, IV, V, VI, IX and X transition metal atoms of the periodic table is contained in the polyolefin resin which is the principal component of the resin composition. COPYRIGHT: (C)2004,JPO
申请公布号 JP2004018579(A) 申请公布日期 2004.01.22
申请号 JP20020172562 申请日期 2002.06.13
申请人 TOPPAN PRINTING CO LTD 发明人 SUZUTA MASAYOSHI;KUROSAWA AKIO;YOSHINAGA MASANOBU;WADA KIYOSHI;KITAJIMA TOMOAKI
分类号 B65D65/02;B32B27/32;B65D65/40;C08F4/54;C08F4/60;C08F4/6192;C08F210/00;C08K3/00;C08L23/00;(IPC1-7):C08L23/00 主分类号 B65D65/02
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