| 发明名称 |
HEAT SINK WITH ENHANCED HEAT SPREADING AND COMPLIANT INTERFACE FOR BETTER HEAT TRANSFER |
| 摘要 |
Heat dissipation systems and structures which are employed in the cooling of electronic devices and/or semiconductor integrated-circuit chips which are installed in computer and/or communications systems. Moreover, disclosed is a method for implementing the heat dissipation systems and structures.
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| 申请公布号 |
US2004011507(A1) |
申请公布日期 |
2004.01.22 |
| 申请号 |
US20020040811 |
申请日期 |
2002.01.07 |
| 申请人 |
INTERNATIONAL BUSINESS MACHINES CORPORATION |
发明人 |
MOK LAWRENCE SHUNGWEI |
| 分类号 |
H01L23/427;(IPC1-7):F28F7/00;F28D15/00;H01L23/34;H05K7/20 |
主分类号 |
H01L23/427 |
| 代理机构 |
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