| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a semiconductor power module that can be miniaturized and is also superior in malfunction resistance. <P>SOLUTION: In a semiconductor unit, a first circuit with a first semiconductor chip mounted on a first lead frame and a second circuit with a second semiconductor chip mounted on a second lead frame are sealed in a resin package. The first lead frame and the second lead frame are arranged overlapped. According to this arrangement, physical dimensions can be reduced, as compared to those of a conventional semiconductor module in which no practical overlap exists. In addition, since the module is packaged using resin, the noise resistance of the semiconductor unit is improved, and malfunction can be reduced further. <P>COPYRIGHT: (C)2004,JPO |
