发明名称 POLISHING BODY, POLISHING DEVICE, SEMICONDUCTOR DEVICE, AND METHOD OF MANUFACTURING THE SAME
摘要 <P>PROBLEM TO BE SOLVED: To provide a polishing body which is capable of improving "the flatness of local pattern" by improving a step elimination property while assuring "global removal uniformity" and furthermore has a long service life. <P>SOLUTION: The polishing body 4 is fitted to a base 5. The polishing body 4 has a structure composed of a polishing pad 6, a hard elastic member 7, and a soft member 8 which are stacked in this sequence from a polishing surface. For example, a stainless steel plate is used as the hard elastic member 7. The polishing pad 6 is formed with a groove 6a cut in the polishing surface. Provided that the thickness of a part of the polishing pad 6 where the groove 6a is formed is represented by d, d is so set as to satisfy a formula, 0mm<d&le;0.6mm. <P>COPYRIGHT: (C)2004,JPO
申请公布号 JP2004023009(A) 申请公布日期 2004.01.22
申请号 JP20020179323 申请日期 2002.06.20
申请人 NIKON CORP 发明人 HOSHINO SUSUMU;SUGAYA ISAO
分类号 B24B37/20;B24B37/22;B24B37/26;B24D13/14;H01L21/304 主分类号 B24B37/20
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