发明名称 |
TRANSFER SHEET, ITS MANUFACTURING METHOD, WIRING BOARD, AND ITS MANUFACTURING METHOD |
摘要 |
PROBLEM TO BE SOLVED: To provide a transfer sheet excellent in high-frequency transmission characteristic and used for forming a fine conductor circuit having excellent accuracy of position. SOLUTION: The transfer sheet 5 has a metallic layer 2 which is formed in a circuit pattern on a substrate 1 and transferred to the surface of an insulating layer 3 at the time of forming the conductor circuit 4. The metallic layer 2 has a coating film 6 composed of an organic resin and having a light transmittance of≤0.4 in the wavelength range of 150-400 nm. Since the portion of the coating film 6 not irradiated with a laser beam protects the metallic layer 2, a fine circuit pattern can be formed without compromising the surface flatness of the metallic layer 2 by suppressing the melting and deformation of the metallic layer 2 caused by the generated heat. COPYRIGHT: (C)2004,JPO |
申请公布号 |
JP2004022842(A) |
申请公布日期 |
2004.01.22 |
申请号 |
JP20020176314 |
申请日期 |
2002.06.17 |
申请人 |
KYOCERA CORP |
发明人 |
MATSUNAGA TAKAHIRO |
分类号 |
H05K3/28;H01L23/14;H05K3/00;H05K3/20;H05K3/46;(IPC1-7):H05K3/20 |
主分类号 |
H05K3/28 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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