| 摘要 |
The present invention provides a method of connecting integrated circuits and a corresponding assembly of integrated circuits. Connecting occurs by performing the steps of: providing a first integrated circuit (C1), which has a first wiring device (K, BP, 4, 41-48, 161-168) on a first main area (HF2), and a second integrated circuit (C2), which has a second wiring device (K, BP, 4, 61-68, 261-268) on a second main area (HF2); at least one of the first wiring device (K, BP, 4, 41-48, 161-168) and second wiring device (K, BP, 4, 61-68, 261-268) having a number of elevated contact areas (161-168, 261-268), which lie on respective elastic elevations (31-38, 51-58), and the other of the first wiring device (K, BP, 4, 41-48, 161-168) and second wiring device (K, BP, 4, 61-68, 261-268) having a number of non-elevated contact areas (61-68, 41-47), which can be aligned in relation to the elevated contact areas (161-168, 261-268); applying a liquid adhesive (300) to at least one of the first and second main areas (HF1, HF2); aligning the first and second main areas (HF1, HF2), so that the non-elevated contact areas (61-68, 41-47) electrically contact the corresponding elevated contact areas (161-168, 261-268); and curing the adhesive (300).
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