发明名称 |
Plating apparatus and method |
摘要 |
A plating apparatus includes a plating vessel for holding a plating bath containing at least metal ions, a conveying device for conveying a long conductive substrate and immersing the long conductive substrate in the plating bath, a facing electrode disposed in the plating bath so as to face one surface of the conductive substrate, a voltage application device for performing plating on the one surface of the conductive substrate by applying a voltage between the conductive substrate and the facing electrode, and a film-deposition suppression device fixedly disposed in the plating vessel so that at least a portion of the film-deposition suppression means is close to shorter-direction edges of the conductive substrate. At least a portion of the film-deposition suppression device close to the shorter-direction edges of the conductive substrate is conductive. By holding the conductive portion of the film-deposition suppression device and the conductive substrate at substantially the same potential, film deposition on the other surface of the conductive substrate is suppressed.
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申请公布号 |
US2004011655(A1) |
申请公布日期 |
2004.01.22 |
申请号 |
US20030606956 |
申请日期 |
2003.06.27 |
申请人 |
TSUZUKI HIDETOSHI;TOYAMA NOBORU;TAKAI YASUYOSHI;HAYASHI RYO;SONODA YUICHI;IWATA MASUMITSU;MIYAMOTO YUSUKE |
发明人 |
TSUZUKI HIDETOSHI;TOYAMA NOBORU;TAKAI YASUYOSHI;HAYASHI RYO;SONODA YUICHI;IWATA MASUMITSU;MIYAMOTO YUSUKE |
分类号 |
C25D21/12;C25D5/02;C25D7/06;C25D9/08;C25D17/10;H01L31/04;(IPC1-7):C25D5/02 |
主分类号 |
C25D21/12 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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