| 发明名称 |
Chip package sealing method |
| 摘要 |
A method of manufacturing a package including manufacturing a substrate to include at least one layer of LCP material, manufacturing a cover made of LCP material to include a lower lip, and sealing the cover to the substrate by heating the interface between the lower lip and the substrate.
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| 申请公布号 |
US2004010910(A1) |
申请公布日期 |
2004.01.22 |
| 申请号 |
US20030460942 |
申请日期 |
2003.06.13 |
| 申请人 |
FARRELL BRIAN;JAYNES PAUL;TAYLOR MALCOLM |
发明人 |
FARRELL BRIAN;JAYNES PAUL;TAYLOR MALCOLM |
| 分类号 |
H01L21/50;H01L23/04;H01L23/06;H01L23/10;(IPC1-7):H01L21/00;H01L21/44 |
主分类号 |
H01L21/50 |
| 代理机构 |
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代理人 |
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| 主权项 |
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