| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a polishing method and a polishing machine in which slurry is surely supplied to a contacting area of a polishing pad constantly contacted with a material to be polished so as to avoid polishing unevenness. <P>SOLUTION: On this polishing method, a lower surface plate 23 provided with the polishing pad 25 to an upper surface is rotated, and the plate-like material W to be polished is pressed onto the polishing pad surface 25a being rotated by an upper surface plate 29 and moved within the polishing pad surface 25a. At the same time, the slurry is supplied onto the polishing pad surface 25a to polish a polishing pad contacting surface of the material W to be polished. The slurry is supplied on to the polishing pad surface 25a by getting it through the polishing pad 25 from a lower surface side of the polishing pad 25. <P>COPYRIGHT: (C)2004,JPO |
