SEMICONDUCTOR DEVICE AND MANUFACTURE THEREOF

摘要

PROBLEM TO BE SOLVED: To shorten a manufacture period of an LSI with a DRAM packaged therein and to reduce the manufacture costs.

SOLUTION: An LSI 9 with the DRAM packaged therein is equipped with a silicon wafer 11, a plurality of the same DRAM regions 21provided on the silicon wafer 11, and logic regions 72provided on the silicon wafer 11.

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