| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a mounting structure of an LED chip, which prevents lowering of the luminance of the light emitted from the LED chip. <P>SOLUTION: In the mounting structure 1 of the LED chip, the LED chip 2, where a first electrode 21 and a second electrode 22 are formed on the surface, is mounted on a substrate 3 on which mounting pads 81 and 82 are formed. Bumps 4, formed to protrude from the surfaces, are arranged on the mounting pads 81 and 82. In the LED chip 2, the first electrode 21 or the second electrode 22 is formed to face the junction face 2a confronted with a substrate 3, and the electrode formed to face the junction face 2a is jointed to the substrate 3 so that it is conductive with the bump 4 and is arranged on the bump 4. <P>COPYRIGHT: (C)2004,JPO |
