| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To easily form a metal colloid pattern which has excellent heat resistance at a satisfactory adhesive strength. <P>SOLUTION: In the method of forming a metal colloid pattern 5 on a substrate 1, the surface of the substrate 1 is coated with a photosensitive resin composition comprising polysilane soluble in an organic solvent, and the organic solvent to form a photosensitive layer 2; the photosensitive layer 2 is selectively exposed to form a latent image part 2a of a pattern; the photosensitive layer 2 is brought into contact with a metal colloid-containing liquid; and the metal colloid is adsorbed on the exposed part 2a to form the pattern 5 of the metal colloid. <P>COPYRIGHT: (C)2004,JPO</p> |
