发明名称 FILM THICKNESS MEASURING METHOD AND APPARATUS THEREFOR
摘要 PROBLEM TO BE SOLVED: To make accurately measurable even an opaque film in a wet state which cannot be measured by a method using a level difference measurement, interference of light, etc. SOLUTION: The film thickness measuring apparatus for measuring the thickness of a wet film M formed by coating the surface of a planar substrate S with a film material in a wet state is provided with a stage 1 for mounting the planar substrate, and setting the wet film upward; a fixing means for vacuum-sucking the substrate; a laser displacement gauge 16 arranged facing the stage; and an eradication means for wiping away the wet film M formed on the surface of the substrate. A first displacement amount to a wet film surface and a second displacement amount to the substrate surface after the wet film is wiped away are measured with the displacement gauge 16. A difference between the first displacement amount and the second displacement amount is assumed to be the thickness of the wet film. COPYRIGHT: (C)2004,JPO
申请公布号 JP2004020203(A) 申请公布日期 2004.01.22
申请号 JP20020171234 申请日期 2002.06.12
申请人 DAINIPPON PRINTING CO LTD 发明人 HATA NAOKI;HAYASHI KENTA;SOEDA MASAHIKO
分类号 G01B11/06;G01B21/08;(IPC1-7):G01B21/08 主分类号 G01B11/06
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