| 摘要 |
PROBLEM TO BE SOLVED: To provide a process for machining a single crystal wafer into a thin silicon wafer 1 in which cracking, or the like, starting from the tapered peripheral can be prevented while facilitating handling of the silicon wafer. SOLUTION: A plurality of silicon wafers 1 having a bevel 2 at the peripheral part are stacked and the bevels 2 at the peripheral part are ground collectively. Subsequently, the surface of individual silicon wafers is back ground to produce a thin silicon wafer 10. COPYRIGHT: (C)2004,JPO
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