ADHESIVE TAPE FOR MASKING, AND RESIN-SEALING METHOD

摘要

PROBLEM TO BE SOLVED: To provide an adhesive tape for masking and a method for resin-sealing capable of securing high adhesiveness and less resin leakage even to a masking surface having large unevenness when resin sealing.

SOLUTION: In the adhesive tape adherently used for masking a terminal part of an electronic component or semiconductor component, one or more heat expanding layers 3 each having a thermal expansion minute ball in an adhesive agent are provided and an adhesive agent layer 4 having no thermal expansion minute ball or its content being smaller than that of the thermal expansion layer 3 on at least one side of a base 1.

COPYRIGHT: (C)2004,JPO