| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a substrate for placing an electronic part which can obtain an electronic apparatus having high airtight reliability. <P>SOLUTION: The substrate for placing the electronic part includes a metallized layer 6 for brazing a substantially square frame-like shape surrounding a placing part 1a separately from the outer periphery of an insulating base 1 on the upper surface of the insulating base 1 having the placing part 1a for placing the electronic part 4 on the upper surface, and a sealing metal frame 2 connected to the metallized layer 6 for brazing with a brazing material 8. The brazing metallized layer 6 has a rounded part R having a radius of curvature of 20 to 50μm formed between the outer peripheral edge and its upper surface. <P>COPYRIGHT: (C)2004,JPO</p> |
