| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a highly reliable semiconductor device and its manufacturing method capable of uniformly forming a protection film. <P>SOLUTION: The manufacturing method includes a process for forming a plurality of semiconductor elements on the surface of a semiconductor substrate 10, a process for forming separation grooves 30 in areas between the semiconductor elements, a process for forming an insulating film 32 on the surfaces of the semiconductor elements so as to cover the inner surfaces of the separation grooves 30, and a process for forming conductive projected parts 27, 28, 29a, 29b so as to connect the surface sides of the semiconductor elements to the element areas of the semiconductor elements. The method includes also a 1st fixing process for integrally fixing the rear side of the semiconductor substrate through a 1st fixing member 33, a process for individually separating the semiconductor elements along the separation grooves, a 2nd fixing process for integrally fixing the rear side of the semiconductor substrate through a 2nd fixing member 34, a process for removing the 1st fixing member, a process for coating the surfaces of individual semiconductor elements with insulating resin 36 from the fitting side of the 1st fixing member, and a process for removing the 2nd fixing member and separating each semiconductor element forming the conductive projected parts on the surface. <P>COPYRIGHT: (C)2004,JPO</p> |
