| 摘要 |
PROBLEM TO BE SOLVED: To provide a sealing resin composition that exhibits an excellent formability and continuous productivity particularly in fabricating a nontypical-shaped package with a different amount of a filler between one side and the other side of the frame and has a heat conductivity of≥1.2 W/mK, and a device for sealing an electronic component using the composition. SOLUTION: The sealing resin composition includes, as indispensable components, (A) an epoxy resin, (B) a phenolic resin, (C) polyethylene glycol and (D) an inorganic filler. The amount of (C) the polyethylene glycol accounts for 0.05-5.0 wt% of the total amount of (A) the epoxy resin, (B) the phenolic resin and (C) the polyethylene glycol. The amount of (D) the inorganic filler accounts for 65-90 wt% of the total amount of the sealing resin composition. The sealing resin composition has a heat conductivity of≥1.2 W/mK. COPYRIGHT: (C)2004,JPO |
