| 摘要 |
PROBLEM TO BE SOLVED: To provide a treatment device which cleans the upper part of a protective means located under a substrate as an object of treatment surely so as to prevent stains from being attached to the substrate in the treatment device comprising a process of cleaning the rear surface of the substrate as a cleaning solution is supplied on it. SOLUTION: The semiconductor wafer substrate 101 is held on a vacuum chuck 102 in a freely rotatable manner, and an annular member 105 is formed below the semiconductor wafer substrate 101 so as to surround the periphery of the vacuum chuck 102. A rear surface cleaning nozzle 106 for supplying a cleaning solution on the rear surface of the substrate 101 is arranged inside the annular member 105. A rear surface cleaning peripheral nozzle 107 for supplying a cleaning solution onto the upper part of the annular member 105 is arranged outside of the rear surface cleaning nozzle 106 in a radial direction and close to the annular member 105. COPYRIGHT: (C)2004,JPO |
