发明名称 |
Control of buried oxide in SIMOX |
摘要 |
A method for forming a semiconductor-on-insulator (SOI) substrate is described incorporating the steps of heating a substrate, implanting oxygen into a heated substrate, cooling the substrate, implanting into a cooled substrate and annealing. The steps of implanting may be at several energies to provide a plurality of depths and corresponding buried damaged regions. Prior to implanting, the step of cleaning the substrate surface and/or forming a patterned mask thereon may be performed. The invention overcomes the problem of raising the quality of buried oxide and its properties such as surface roughness, uniform thickness and breakdown voltage Vbd.
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申请公布号 |
US2004013886(A1) |
申请公布日期 |
2004.01.22 |
申请号 |
US20020200822 |
申请日期 |
2002.07.22 |
申请人 |
INTERNATIONAL BUSINESS MACHINES CORPORATION |
发明人 |
FOX STEPHEN RICHARD;GARG NEENA;GIEWONT KENNETH JOHN;LEE JUNEDONG;MAURER SIEGFRIED LUTZ;MOY DAN;NORCOTT MAURICE HEATHCOTE;SADANA DEVENDRA KUMAR |
分类号 |
H01L21/762;(IPC1-7):B32B9/04;H01L21/76 |
主分类号 |
H01L21/762 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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