| 摘要 |
The invention provides a device and method for enclosure of electronic circuits. An encapsulated electronic circuit device has a circuit board further comprising, electronic conductive paths, at least one electronic component, and an energy source, and an enclosure encapsulating the circuit board, substantially covering the front and back-side of the circuit board. The enclosure is composed of a polyurethane material. The circuit device preferably has a design imprinted on the front of the circuit board. The printing process is optionally a silk screening method.
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