发明名称 |
METHOD FOR PRODUCING ELECTRONIC COMPONENTS |
摘要 |
The invention concerns a method enabling integration of functional structures in the package housing electronic components, for producing an electronic component comprising at least a semiconductor having on at least one side, at least an active detecting and/or transmitting device. Said method is characterized in that it comprises the following steps: preparing at least a chip on a wafer, preparing at least a support structure having at least a functional structure for the active detecting and/or transmitting device, assembling the wafer to at least a support, so that the side of the chip including the active detecting and/or transmitting device faces the support, separating the chip. |
申请公布号 |
WO03019617(A3) |
申请公布日期 |
2004.01.22 |
申请号 |
WO2002EP09497 |
申请日期 |
2002.08.26 |
申请人 |
SCHOTT GLAS;CARL-ZEISS-STIFTUNG TRADING AS SCHOTT GLAS;CARL-ZEISS-STIFTUNG;LEIB, JUERGEN;BIECK, FLORIAN |
发明人 |
LEIB, JUERGEN;BIECK, FLORIAN |
分类号 |
H01L27/14;H01B13/00;H01L;H01L25/16;H01L31/02;H01L31/0232;H01L33/00 |
主分类号 |
H01L27/14 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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