发明名称 DEVICE AND METHOD FOR TREATING SUBSTRATE
摘要 PROBLEM TO BE SOLVED: To perform a spin cleaning on substrates having mutually different sizes without generating water marks by using the same device. SOLUTION: A spin cleaner is provided with a treating chamber 4 in which spin cleaning is performed on the substrates W, a chuck 5 which horizontally holds the substrates W in the chamber 4, and a motor 6 which rotates the substrates W held by the chuck 5. The chuck 5 can hold substrates W having different sizes. The treating chamber 4 is composed of a treating chamber main body 8 and a jig 9 which can be attached to and detached from the main body 8. An opening 12 is formed in the jig 9 so as to introduce the outside air into the chamber 4. A plurality of tools 9 having mutually different opening diameters is prepared in advance and the air current in the chamber 4 is controlled by selectively using the tools 9 in accordance with the sizes of the substrates W. COPYRIGHT: (C)2004,JPO
申请公布号 JP2004022776(A) 申请公布日期 2004.01.22
申请号 JP20020175285 申请日期 2002.06.17
申请人 HOYA CORP 发明人 TANAKA TOMOKAZU
分类号 G03F7/42;B08B3/02;H01L21/027;H01L21/304;H01L21/306;(IPC1-7):H01L21/304 主分类号 G03F7/42
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