发明名称 |
ETCHING DEVICE AND TREATMENT METHOD |
摘要 |
PROBLEM TO BE SOLVED: To provide an etching method by which a unexpected side effects can be reduced when feedback controlling and a control model be constructed without requiring much manpower or time. SOLUTION: The etching device is used to etch a single film 113 through a plurality of etching steps with different recipes. A preset recipe is applied to a final etching step (step 5), where to a lower layer film contact is affected by the film 113, and a recipe-generating means is provided to generate a recipe to be applied to the other etching steps (step 4) on the basis of a treatment result. The etching treatment is applied, based on the recipe generated by the recipe generation means. COPYRIGHT: (C)2004,JPO
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申请公布号 |
JP2004022747(A) |
申请公布日期 |
2004.01.22 |
申请号 |
JP20020174616 |
申请日期 |
2002.06.14 |
申请人 |
HITACHI LTD;HITACHI HIGH TECH CORP |
发明人 |
KAGOSHIMA AKIRA;KIKKAI MOTOHIKO;YAMAMOTO HIDEYUKI;SHIRAISHI DAISUKE;TANAKA JUNICHI;TAMAOKI KENJI;MORIOKA NATSUYO |
分类号 |
H01L21/3065;H01L21/00;H01L21/3213;H01L21/66;(IPC1-7):H01L21/306 |
主分类号 |
H01L21/3065 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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