发明名称 ETCHING DEVICE AND TREATMENT METHOD
摘要 PROBLEM TO BE SOLVED: To provide an etching method by which a unexpected side effects can be reduced when feedback controlling and a control model be constructed without requiring much manpower or time. SOLUTION: The etching device is used to etch a single film 113 through a plurality of etching steps with different recipes. A preset recipe is applied to a final etching step (step 5), where to a lower layer film contact is affected by the film 113, and a recipe-generating means is provided to generate a recipe to be applied to the other etching steps (step 4) on the basis of a treatment result. The etching treatment is applied, based on the recipe generated by the recipe generation means. COPYRIGHT: (C)2004,JPO
申请公布号 JP2004022747(A) 申请公布日期 2004.01.22
申请号 JP20020174616 申请日期 2002.06.14
申请人 HITACHI LTD;HITACHI HIGH TECH CORP 发明人 KAGOSHIMA AKIRA;KIKKAI MOTOHIKO;YAMAMOTO HIDEYUKI;SHIRAISHI DAISUKE;TANAKA JUNICHI;TAMAOKI KENJI;MORIOKA NATSUYO
分类号 H01L21/3065;H01L21/00;H01L21/3213;H01L21/66;(IPC1-7):H01L21/306 主分类号 H01L21/3065
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