| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a polishing apparatus, a washing apparatus and method, and a wafer saving program by which a wafer surface is prevented from oxidation and property change in respective processes of a polishing process, a carrying process after this, a washing process, a drying process, an inspection process, and a housing process of a wafer. <P>SOLUTION: The wafer polishing apparatus 10 for polishing the wafer surface or the wafer washing apparatus is provided with a carrying and washing chamber 82 for cutting off the wafer from air in an outer world, and an inactive gas feeding means 69 for filling the carrying and washing chamber 82 with an inactive gas. <P>COPYRIGHT: (C)2004,JPO |
