METHOD FOR THE PRODUCTION OF A COVER, METHOD FOR THE PRODUCTION OF A CASED COMPONENT

摘要

Disclosed are a method for producing a cover and a method for producing a cased component. According to the method for producing a cover for an area (30) of a substrate (10), a frame structure (18) is initially produced in said area (30) of the substrate (10), whereupon a lid structure (20) is mounted on the frame structure (18) so as to cover the area (30) underneath the lid structure, whereby sensitive components (14) are protected in a simple manner and at low production costs from external influences and particularly from an encapsulating material used for encapsulating the entire cased component which is created when an individual chip (26) is encapsulated.