| 摘要 |
PROBLEM TO BE SOLVED: To process a copper processed wafer and a non-copper processed wafer using an electron beam inspection apparatus, without copper contamination. SOLUTION: All portions, in contact with a wafer 1 within the apparatus such as hands 12A, 12B or the like of a wafer transfer machine 4, are prepared in two or more systems, and the contact areas are used selectively, either exclusively for the copper processed wafer or for non-copper process wafer. COPYRIGHT: (C)2004,JPO |
