| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a substrate for manufacturing a semiconductor package suitable for various types of semiconductor chips of different lead specifications, and also to provide a method of manufacturing the same. <P>SOLUTION: The substrate 1 comprises a stage formation section 3 thereon, many terminals 5 for internal connection arranged near the stage formation section, and many terminals 6 for external connection which are made opposite to the terminals for internal connection on a rear surface side of the substrate. Conductive paths between the terminals for internal and external connection are slot-like via holes 7. The substrate is manufactured by first mounting semiconductor chips 2 on the stage formation section, and then connecting the semiconductor chips and the terminals for internal connection by conductive materials 21 and sealing the whole substrate with resin. Thereafter, cutting the substrate chip by chip according to a desired terminal for external connection. The via holes at a cutting position are shared by adjacent semiconductor packages at the time of cutting in half. <P>COPYRIGHT: (C)2004,JPO |
