| 摘要 |
<P>PROBLEM TO BE SOLVED: To improve accuracy for detecting an end point of polishing without deteriorating a throughput of a CMP device. <P>SOLUTION: A reflection plate 36 for generating reference lights is installed inside an annular dresser 32 on a bottom surface of a dresser head 30 for dressing a polishing surface of a polishing pad 12. During a dressing step, when a sensor part 47 of a spectrometry part 40 installed inside a turntable 10 passes below the reflection plate 36, reflection lights at n of measuring points on the reflection plate36 are measured, so as to obtain n of spectrums corresponding to respecting detection signals at a signal processing part 50. By integrating data of the spectrum, one reference spectrum as a reference at the time of calculating a reflection rate is calculated, so as to store the data. While a semiconductor substrate 21 is polished, a measured spectrum is obtained from the reflection lights by the substrate 21, and the reflection rate is found on the basis of the reference spectrum, so as to calculate a poliling degree. <P>COPYRIGHT: (C)2004,JPO |
