发明名称 |
RESIN WELDING APPARATUS, RESIN TEMPERATURE MEASURING INSTRUMENT, RESIN WELDING METHOD AND RESIN TEMPERATURE MEASURING METHOD |
摘要 |
<P>PROBLEM TO BE SOLVED: To provide a resin welding apparatus capable of accurately detecting a welding temperature when resin members are welded mutually by utilizing a laser beam, a resin temperature measuring instrument, a resin welding method and a resin temperature measuring method. <P>SOLUTION: The resin welding apparatus 1A for mutually welding resin members DR and UR by utilizing the laser beam LB is equipped with a semiconductor laser emitting the laser beam LB (semiconductor laser device 20A) and a filter 30 provided between the semiconductor laser and the resin member UR and cutting off a beam with a wavelength becoming an observation wavelength when the temperatures of welded regions DA and UA in the beam emitted by the semiconductor laser. When the temperatures of the welded regions DA and UA are measured, the beam with a wavelength cut off by the filter 30 is used. <P>COPYRIGHT: (C)2004,JPO |
申请公布号 |
JP2004017540(A) |
申请公布日期 |
2004.01.22 |
申请号 |
JP20020177652 |
申请日期 |
2002.06.18 |
申请人 |
HAMAMATSU PHOTONICS KK |
发明人 |
MATSUMOTO SATOSHI;KOSUGI TAKESHI |
分类号 |
B23K26/00;B23K26/03;B23K26/06;B23K26/32;B23K26/40;B23K26/42;B29C65/00;B29C65/16;G01J5/06;H01S3/00 |
主分类号 |
B23K26/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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