发明名称 METHOD FOR MANUFACTURING HERMETIC SEALING BODY OF ELEMENT, AND REFLOW FURNACE
摘要 PROBLEM TO BE SOLVED: To provide a manufacturing method of a hermetic sealing body in an element having high work efficiency. SOLUTION: Processes (S<SB>1</SB>to S<SB>4</SB>) where an assembly body of the hermetic sealing body, in which an element is disposed on a base plate having a lower wall, a ceiling wall is placed on the base plate in a state that an upper wall is positioned to the lower wall, is arranged in a chamber of a reflow furnace; the chamber is vacuumed; filler gas is introduced into the chamber of the reflow furnace and the chamber is made to have prescribed pressure, and a process (S<SB>5</SB>) where a peripheral wall is formed by reflowing a solder layer formed on either of at least the lower wall and the upper wall and by soledering the lower wall and the upper wall, and the element is sealed in a hollow part where filler gas is sealed are arranged. Then, processes (S<SB>6</SB>to S<SB>8</SB>) where a filler gas atmosphere in the chamber is substituted for an inert gas comprising helium (He), the chamber is evacuated and a helium test is performed, and processes (S<SB>9</SB>and S<SB>10</SB>) where air or an inert gas is introduced, pressure inside and outside the chamber is balanced, and the hermetic sealing body is taken out from the reflow furnace are also arranged. COPYRIGHT: (C)2004,JPO
申请公布号 JP2004023054(A) 申请公布日期 2004.01.22
申请号 JP20020179967 申请日期 2002.06.20
申请人 SONY CORP 发明人 YAMAGUCHI SEIYA
分类号 H01L23/20;H01L23/02;H01L31/02;H01S5/022;(IPC1-7):H01L23/20 主分类号 H01L23/20
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