发明名称 APPARATUS AND METHOD FOR TREATING SUBSTRATE
摘要 PROBLEM TO BE SOLVED: To provide an apparatus for treating a substrate capable of repeatedly and effectively utilizing a rinsing liquid for rinsing a substrate. SOLUTION: The apparatus for treating a substrate comprises a rinsing chamber 5 in which a substrate is rinsed with a rinsing liquid, a plurality of rinsing liquid feeders 17-19 arranged along the transfer direction of the substrate in the rinsing chamber and feeding the rinsing liquid along a direction intersecting the transfer direction of the substrate, a reservoir 56 having first to third recovery sections in which the rinsing liquid fed from the plurality of rinsing liquid feeders is recovered as separate rinsing liquids, and first to third return pipes through which the separately recovered rinsing liquids in the reservoir 56 are returned to the rinsing liquid feeders situated one more upstream in the transfer direction of the substrate. COPYRIGHT: (C)2004,JPO
申请公布号 JP2004016997(A) 申请公布日期 2004.01.22
申请号 JP20020178771 申请日期 2002.06.19
申请人 SHIBAURA MECHATRONICS CORP 发明人 NISHIBE YUKINOBU;ISO AKINORI;SUEYOSHI HIDEKI
分类号 G02F1/13;B08B3/02;G03F7/42;H01L21/027;H01L21/304;(IPC1-7):B08B3/02 主分类号 G02F1/13
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