| 摘要 |
PROBLEM TO BE SOLVED: To provide mold equipment which uniformly seals a package part with a resin and also dispenses with scrap handling, by making the sealing resin overflow in an area of a workpiece. SOLUTION: An overflow cavity communicating with a cavity recess part 7 is provided in a clamping face of a top force 6, outside an area P of forming the package part of the workpiece 1 and inside a base plate area Q. COPYRIGHT: (C)2004,JPO |
