| 摘要 |
PROBLEM TO BE SOLVED: To solve the problem that, in a manufacturing process of a semiconductor device, especially, in limited production of diversified products such as a system LSI, an optimization job for exposure causes increase in TAT in device manufacturing and decline in operation rate of an exposure apparatus. SOLUTION: A focus offset in the exposure of a device product is different for each product, exposure layer, and exposure apparatus. The focus offset is calculated for various causes, as (1) a focus position of a projection optical system of an exposure apparatus and an offset of a focus sensor (offset caused by apparatus), (2) a focus offset determined by pattern conditions for an exposure layer of a device product and an aberration of the projection optical system of the exposure apparatus (offset caused by pattern), and (3) a focus offset of the exposure apparatus caused by a process wafer corresponding to the exposure layer of the device product (offset caused by process). An optimal focus position for exposure of a product which is determined based on the calculated focus offsets is set in a recipe, and then exposure is executed. COPYRIGHT: (C)2004,JPO |
