WAFER CASSETTE

摘要

A wafer cassette includes a plate (13) for supporting a semiconductor wafer contained, a top plate (11) arranged above the plate (13), a bottom plate (12) arranged below the plate (13), and a rod (14) thrusting the plate (13) and reaching from the top plate (11) to the bottom plate (12). The plate (13) is configured so as to support the entire surface of the semiconductor wafer. Even a thin semiconductor wafer or a semiconductor wafer divided by tip-dicing can be safely and surely supported and contained. Accordingly, a semiconductor wafer or a semiconductor chip is not damaged during processing or convey.