发明名称 Process and apparatus for fixation of the individual layers of a multilayered circuit board
摘要 The method involves mutually fixing the inner layers aligned parallel to the main plane of the packet by stamping the small plates forming the inner layers to bend at least one tongue out of each small plate that protrudes into the corresponding aperture formed in the next small plate by bending out the tongue to form a shape-locking connection between the small plates. AN Independent claim is also included for an arrangement for implementing the inventive method.
申请公布号 EP1383366(A1) 申请公布日期 2004.01.21
申请号 EP20020405614 申请日期 2002.07.17
申请人 PRINTPROCESS AG 发明人 MAUERER, HARTMUT
分类号 H05K3/46 主分类号 H05K3/46
代理机构 代理人
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