摘要 |
<p>A cooling device for an electronic apparatus, comprising: a heat generating element (7) attached within a first housing (1); a heat receiving jacket (8), being connected with said heat generating element, and being attached within said first housing; a second housing (2) being rotatably supported on said first housing; a first heat exchanger (15) attached within said second housing, for exchanging heat between an outside; and a liquid driving means (11) for supplying a cooling liquid to said heat receiving jacket, wherein a portion of a pipe for connecting between said heat receiving means, said first heat exchanger, and said liquid driving means is made of a flexible tube made of a resin, and further wherein, a second heat exchanger (9) and an ion exchanger (16) are provided in a part of said pipe, said second heat exchanger is received within said second housing, and said ion exchanger is received within said second housing.</p> |
申请人 |
HITACHI, LTD. |
发明人 |
MINAMITANI, RINTARO;OHASHI, SHIGEO;KONDO, YOSHIHIRO;YOSHITOMI, YUJI;NAGANAWA, TAKASHI;NAKANISHI, MASATO;NAKAGAWA, TSUYOSHI |