| 摘要 |
An optical semiconductor module includes an optical semiconductor element 1,4, an optical fiber 7 optically coupled with the semiconductor element; a base 11 having an upper surface and a lower surface; and a package 208. The package has a bottom plate 208e on which the base is mounted, a front wall 208c, having a hole through which the optical fiber is inserted, and a rear wall 208d opposite to the front wall. The optical fiber and the optical semiconductor element are mounted on the upper surface. The base has a rear face formed on an end portion opposite to the front wall 208c, and the rear face is positioned above the lower surface of the base e.g. caused by taper 11b. In another module, plate 709a may be integrated with lid 709. Snout 208b may be internally tapered at 208a, longitudinally hole 708a may have different internal diameter 708a1 and 708a2. |
