| 发明名称 |
Semiconductor wafer support with graded thermal mass |
| 摘要 |
An annular-shaped edge ring support (38) for a semiconductor wafer (12) has an innermost radial portion (66) for supporting the semiconductor wafer and an outermost radial portion (68) contiguous with the inner portion. The inner portion has a graded thermal mass that generally increases with increasing radius. <IMAGE> |
| 申请公布号 |
EP0821403(A3) |
申请公布日期 |
2004.01.21 |
| 申请号 |
EP19970305295 |
申请日期 |
1997.07.16 |
| 申请人 |
APPLIED MATERIALS, INC. |
发明人 |
TIETZ, JAMES V.;BIERMAN, BENJAMIN;BALLANCE, DAVID S. |
| 分类号 |
H01L21/683;H01L21/205;H01L21/22;H01L21/26;H01L21/687 |
主分类号 |
H01L21/683 |
| 代理机构 |
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代理人 |
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| 主权项 |
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| 地址 |
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