发明名称 |
Thermosiphon for electronics cooling with high performance boiling and condensing surfaces |
摘要 |
<p>A thermosiphon (12) for cooling an electronic device (8) having a mean width of dimension "b" (9) comprises a boilerplate (30) having a top surface (33) and including a plurality of pyramid shaped fins (40) projecting upwardly from the top surface (33). The boilerplate also has a bottom surface (32) for receiving the electronic device (8) to be cooled. A plurality of spaced apart condenser tubes (42) is mounted above the boilerplate (30) such that the boilerplate (30) and the condenser tubes (42) define a vapor chamber (54) therebetween for receiving a working fluid therein. A plurality of convoluted fins (58) extends between each adjacent pair of condenser tubes (42).</p> |
申请公布号 |
EP1383369(A2) |
申请公布日期 |
2004.01.21 |
申请号 |
EP20030076968 |
申请日期 |
2003.06.25 |
申请人 |
DELPHI TECHNOLOGIES, INC. |
发明人 |
REYZIN, ILYA;BHATTI, MOHINDER S.;GHOSH, DEBASHIS;JOSHI, SHRIKANT MUKUND |
分类号 |
H05K7/20;F28D15/02;H01L23/427;(IPC1-7):H05K7/20 |
主分类号 |
H05K7/20 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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