发明名称 |
Cleaning method and cleaner |
摘要 |
A substrate cleaning method of the present invention enables effective cleaning of a wafer having a recess therein without causing any increase in cleaning costs. Ozone gas and ammonia water are supplied to an area right above a wafer 7 having a recess therein, and a gas-dissolving liquid is produced by dissolving the ozone gas in the ammonia water. The gas-dissolving liquid is used to carry out contact and non-contact types of physical cleaning on the wafer.
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申请公布号 |
US6679950(B2) |
申请公布日期 |
2004.01.20 |
申请号 |
US20010892742 |
申请日期 |
2001.06.28 |
申请人 |
EBARA CORPORATION |
发明人 |
TOMITA HIROSHI;SATO MOTOYUKI;NADAHARA SOICHI;SHIRAKASHI MITSUHIKO;ITO KENYA |
分类号 |
B01F3/04;B01F5/04;B08B1/00;B08B1/04;B08B3/02;B08B3/08;B08B7/04;H01L21/00;H01L21/304;(IPC1-7):B08B3/00 |
主分类号 |
B01F3/04 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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