发明名称 Method for manufacturing a semiconductor memory
摘要 The method for manufacturing a Semiconductor Memory according to the present invention comprises a step for forming a gate insulator film on the surface of a semiconductor substrate; a step for forming a mask layer having a through-hole provided in the position where a tunnel window is to be formed, on top of said gate insulator film; a step for forming an impurity region in the vicinity of the surface of said semiconductor substrate by introducing an impurity using the mask layer; and a step for forming a tunnel insulator film on the surface of the semiconductor substrate, using a mask layer. In the present invention, the position in which the source is formed and the position in which the tunnel window is formed are determined by means of the position of the same through-hole. Therefore, the manufacturing error in the distance between the tunnel window and the source can be nullified.
申请公布号 US6680225(B2) 申请公布日期 2004.01.20
申请号 US20020278802 申请日期 2002.10.24
申请人 OKI ELECTRIC INDUSTRY CO., LTD. 发明人 MIYAGI SUSUMU
分类号 H01L21/28;H01L21/336;H01L21/8247;H01L27/115;H01L29/423;H01L29/788;H01L29/792;(IPC1-7):H01L21/823;H01L21/22;H01L21/320;H01L21/31 主分类号 H01L21/28
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