| 发明名称 |
Method of electrodepositing copper |
| 摘要 |
Disclosed are electrolytes for copper electroplating that provide enhanced fill of small features with less overplate. Also disclosed are methods of plating substrates, such as electronic devices, using such electrolytes.
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| 申请公布号 |
US6679983(B2) |
申请公布日期 |
2004.01.20 |
| 申请号 |
US20010976421 |
申请日期 |
2001.10.12 |
| 申请人 |
SHIPLEY COMPANY, L.L.C. |
发明人 |
MORRISSEY DENIS;MIKKOLA ROBERT D.;CALVERT JEFFREY M. |
| 分类号 |
C25D3/02;C25D3/38;C25D5/02;C25D5/48;C25D5/52;C25D7/12;C25D11/32;(IPC1-7):C25D7/12 |
主分类号 |
C25D3/02 |
| 代理机构 |
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代理人 |
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| 主权项 |
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