发明名称 |
Conductive powder and making process |
摘要 |
A conductive powder having an organic silicon polymer layer on the surface of each particle and a metal layer enclosing the silicon polymer layer possesses a stronger bond between the particle base and the metal even at elevated temperature and exhibits a high and stable conductivity and heat resistance.
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申请公布号 |
US6680081(B2) |
申请公布日期 |
2004.01.20 |
申请号 |
US20020102846 |
申请日期 |
2002.03.22 |
申请人 |
SHIN-ETSU CHEMICAL CO., LTD. |
发明人 |
FUKUSHIMA MOTOO;ITOH KUNIO;MORI SHIGERU;KASASHIMA MASAKI;HAMADA YOSHITAKA;ARAMATA MIKIO |
分类号 |
H01B1/12;H01B1/22;H05K3/32;(IPC1-7):C23C18/32;B05D3/10;B05D7/00 |
主分类号 |
H01B1/12 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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