| 摘要 |
FIELD: assembling microelectronic equipment using three-dimensional chip components as source objects. SUBSTANCE: proposed method involves use of high-reliability and low-cost electronic components in assembling electronic equipment and limited manufacture of lacking components by commonly used technology. Use is made of high-reliability methods for interconnections as well as mechanization and automation of production processes employing standard process equipment. EFFECT: enhanced yield of modules using smaller chips at improved performance characteristics. 15 cl, 9 dwg |
