发明名称 Semiconductor substrate
摘要 A thick GaN layer is grown on sapphire through an Au layer at a temperature lower than the melting point of 1064° C. of the Au layer, and temperature of a sample is raised to reach and exceed the melting point of the Au layer so that the Au layer is dissolved. In this state, the sapphire and GaN layer are separated from each other.
申请公布号 US6679947(B2) 申请公布日期 2004.01.20
申请号 US20020237603 申请日期 2002.09.10
申请人 TOYODA GOSEI CO., LTD. 发明人 KOIKE MASAYOSHI;NAGAI SEIJI
分类号 C23C16/34;H01L21/02;H01L21/20;H01L21/205;H01L33/00;H01L33/12;H01L33/32;H01S5/02;H01S5/323;(IPC1-7):C30B25/02;C30B25/04 主分类号 C23C16/34
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